spec no: dsal0864 rev no: v.5 date: apr/25/2015 page: 1 of 6 approved: wynec checked: allen liu drawn: q.m.chen erp: 1201006871 3.5x2.8mm phototransistor part number: AA3528P3S features z mechanically and spectrally ma tched to the infrared emitting led lamp. z package : 2000pcs / reel. z moisture sensitivity level : level 3. z rohs compliant. description made with npn silicon phototransistor chips. package dimensions notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. the specifications, characteristics and technical data descri bed in the datasheet are subject to change without prior notice . 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications.
spec no: dsal0864 rev no: v.5 date: apr/25/2015 page: 2 of 6 approved: wynec checked: allen liu drawn: q.m.chen erp: 1201006871 handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more su sceptible to damage by external mechanical force. as a result, special handling precau tions need to be observed during asse mbly using silicone encapsulated led products. failure to comply might lead to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing ex posed leds. impact may scratch the silicone lens or damage the internal circuitry. 4.1. the inner diameter of the smd pickup nozzle should not exceed the size of the led to prevent air leaks. 4.2. a pliable material is suggested fo r the nozzle tip to avoid scratching or damaging the led surface during pickup. 4.3. the dimensions of the component must be accurately program med in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. as silicone encapsulation is permeable to gases, some corro sive substances such as h 2 s might corrode silver plating of leadframe. special care should be taken if an led with silicone encapsulation is to be used near such substances.
spec no: dsal0864 rev no: v.5 date: apr/25/2015 page: 3 of 6 approved: wynec checked: allen liu drawn: q.m.chen erp: 1201006871 electrical / optical characteristics at ta=25c absolute maximum ratings at ta=25c symbol parameter min. typ. max. units test conditions v br ceo collector-to-emitter breakdown voltage 30 v i c =100ua ee=0mw/c O v br eco emitter-to-collector breakdown voltage 5 v i e =100ua ee=0mw/c O v ce (sat) collector-to-emitter saturation voltage 0.8 v i c =2ma ee=20mw/c O i ceo collector dark current 100 na v ce =10v ee=0mw/c O t r rise time (10 to 90 ) 15 us v ce = 5v i c =1ma r l =1000 ? t f fall time (90 to 10 ) 15 us i (on) on state collector current 0.2 0.4 ma v ce = 5v ee=1mw/c O =940nm parameter max.ratings collector-to-emitter voltage 30v emitter-to-collector voltage 5v power dissipation at (or below) 25c free air temperature 100mw operating temperature -40c to +85c storage temperature -40c to +85c
spec no: dsal0864 rev no: v.5 date: apr/25/2015 page: 4 of 6 approved: wynec checked: allen liu drawn: q.m.chen erp: 1201006871
spec no: dsal0864 rev no: v.5 date: apr/25/2015 page: 5 of 6 approved: wynec checked: allen liu drawn: q.m.chen erp: 1201006871 AA3528P3S recommended soldering pattern (units : mm; tolerance: 0.1) tape specifications (units : mm) reel dimension reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product.
spec no: dsal0864 rev no: v.5 date: apr/25/2015 page: 6 of 6 approved: wynec checked: allen liu drawn: q.m.chen erp: 1201006871 packing & label specifications AA3528P3S terms and conditions for the usage of this document 1. the information included in this docum ent reflects representative usage scenarios and is intended for technical reference on ly. 2. the part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. before production usage customer should refer to the latest datasheet for the updated specifications. 3. when using the products referenced in this document, please make sure the produc t is being operated within the environmental and electrical limits specified in the dat asheet. if customer usage exceeds the spec ified limits, kingbright will not be respon sible for any subsequent issues. 4. the information in this document applies to typical usage in consumer electronics applicati ons. if customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with kingbright representative for further assistance. 5. the contents and information of this document may not be reproduced or re-transmitted without permission by kingbright. 6. all design applications should refer to kingbright application notes available at http://www.kingbrightusa.com/applicationnotes
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